The advanced SiP double-sided molded BGA platform has become an industry technology standard in this domain. Applying leading-edge design rules for 3D component placement and double-sided molding, ...
Front end module use could reach 50% penetration in Europe by 2006/7, but the market is complex with definitions varying from OEM to OEM. Colin Whitbread unravels the latest technical developments, ...
The shift to 5G wireless networks is driving a need for new IC packages and modules in smartphones and other systems, but this move is turning out to be harder than it looks. For one thing, the IC ...
Avago Technologies, a leading supplier of analog interface components for communications, industrial and consumer applications, announced a highly efficient front-end module for WiFi access points.
Avago Technologies (Nasdaq: AVGO), a leading supplier of analog interface components for communications, industrial and consumer applications, today announced a complete RF front-end module (FEM) for ...
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