Power Integrations recommends the use of IR/convection reflow for surface-mount attach of the InSOP package. However, the InSOP package was designed with wave soldering in-mind in case IR/ convection ...

This application note focuses on Power Integrations Qspeed™ devices which are lead-free and comply with RoHS standard and other environmental requirements. This document covers the typical wave ...

Applying liquid solder to the underside of printed circuit boards in order to bond the chips and discrete components that are placed on top of the board and whose metal leads (pins) extend through the ...

Sasinno Americas is set to exhibit its latest advancements at Booth 4027 during the 2024 IPC APEX EXPO, taking place April 9-11, 2024 at the Anaheim Convention Center in California. The company will ...

In our last installment of Tools of the Trade, we had just finished doing the inspection of the surface mount part of the PCB. Next in the process is the through hole components. Depending on the PCB, ...