At The Next FPGA Platform event in San Jose, California on January 22, Jose Alvarez, Intel PSG CTO, Jose Alvarez outlined the three levels of heterogeneous integration. It’s a simple taxonomy. First, ...

Market opportunities include enhancing phone-car interconnection functions, expanding smart ecosystem connectivity across devices, introducing unified IoT protocols for comprehensive vehicle-centered ...

Newport Beach, CA—Jazz Semiconductor announced the availability of a 17-GHz vertical PNP (VPNP) module on its 0.18um RFCMOS platform. The addition of the VPNP module to its RFCMOS platform enables the ...

For many years, system-in-package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...

Electrical Function Integration places the control over exactly where components, wire, conductors and connectors are in the hands of the designer. Source: Q5D Wire harnesses are the backbone of ...