Alexander Battery Technologies (ABT), a UK battery pack manufacturer, has set out a clearer framework for how OEMs can approach battery development. The new approach defines four routes into battery ...

Würth Elektronik has expanded its free design tool REDEXPERT to include the Current Sense Transformer Selector. It allows developers to select the appropriate current sense transformers based on ...

OKW’s MOTEC plastic enclosures for desktop electronics can now be specified with a sloping front panel and an adjustable carry handle/desk stand for easier viewing and operation. The stylish enclosure ...

The partnership reinforces Advantech’s commitment to industrial cybersecurity and supports customer readiness for evolving European cybersecurity requirements, including the Cyber Resilience Act (CRA) ...

Toshiba Electronics Europe GmbH has released two sine-wave PWM drive controllers – TC78B043FNG and TC78B043FTG – for three-phase BLDC motors, which can support surface permanent magnet (SPM) and ...

The module is packaged in an innovative vertical construction that maximises board space efficiency and can provide up to a 40% board area reduction when compared to other solutions. The compact power ...

The company is known for basing its compilers on the proven open-source technology LLVM – upgraded now to LLVM 17 – which ...

Now available through Powell Electronics is ITT Cannon’s Veam MOVE-MOD modular connector series, an innovative connector ...

Since entering operation, the pilot line has generated concrete advances across its core domains, spanning substrates, ...

EN 18052:2025 is the European standard defining end-to-end conformance testing for eCall services operating in hybrid environments with coexistent circuit-switched 2G and 3G networks and ...

Variscite has released a new series of SoMs/CoMs that conform to the SMARC interface standard. The company's first SMARC-compatible SoM series begins with the NXP i.MX 8M Plus processor-powered ...

Point2 Technology have announced a strategic collaboration to validate next-generation, multi-terabit interconnects designed to eliminate scale-up connectivity bottlenecks in AI and ML data centres.